Facilities
As a daughter company of the NMI institute, we use their facilities for production and development.
Cleanroom
- 160 m²
- Variable substrate size: 2 to 6 inch
- Substrates: glass, wafers, foils
- Fabrication of small batches 10 – 10.000 substrates/a
Coating technology
- PVD (sputtering, evaporation)
- PECVD
- Microelectroplating
- Spincoating
- Silicon micromechanics
Materials
- Metals (Ti, Pt, Au, Ir, ITO, …)
- Insulators (SiN, SiO, SiCxOy, …)
- Dielectrics (TiO2, ZrO2, BaTiO3)
- Polymers (Polyimide, parylene, SU-8, PDMS, …)
Patterning, Lithography
- Semi-automated optical lithography (1 µm resolution)
- Electron beam and focused ion beam lithography (< 50 nm – 1 µm)
- Plasma etching
- Wet chemical etching
- Direct writing with laser (>30 µm)
Assembly and packaging technology
- Conductive glueing
- Adhesive bonding
- Soldering
- Wire bonding
- Flip-chip bonding